Removal of high stress zones in electronic assemblies

An electronic board comprising:

• a printed circuit having a connection face defining a plane including two pads, the two pads being separated by a first distance when the electronic board is at ambient temperature, and
• an electronic component including two terminal, each terminal being soldered or sintered on an associated pad of the two pads by means of a solder or sintering joint, the two terminals being separated by a second distance when the electronic board is at ambient temperature,
• wherein the printed circuit having a first thermal expansion coefficient (CTEPCB) in the plane, the electronic component has a second thermal expansion coefficient (CTESMC) in the plane and the solder joint having a third thermal expansion coefficient (CTEJ) in the plane, and
• wherein the first distance (LPCB) is substantially equal to a quotient of a difference between the first thermal expansion coefficient (CTESMC) and the third thermal expansion coefficient (CTEJ) and of a difference between the second thermal expansion coefficient (CTEPCB) and the third thermal expansion coefficient (CTEJ), all multiplied by the second distance (LCMS):
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• so that orthogonal projections of the two terminals of the electronic component on the connection face of the printed circuit do not overlap the associated pads of the two pads.