Semiconductor Package with Compact Antenna Formed Using Three-Dimensional Additive Manufacturing Process

A semiconductor device package comprising:

• a semiconductor device die comprising an active side and a back side opposite the active side, wherein the active side comprises a plurality of signal pads;
• and
• an antenna structure comprising
• a ground plane formed of a conductive layer on a first layer of a first dielectric material, wherein
• the back side of the semiconductor device die defines a first plane,
• the first layer of the first dielectric material is formed laterally adjacent to the semiconductor device die,
• a bottom surface of the first layer of the first dielectric material is planar with the back side of the semiconductor device die, and
• at least a portion of the first layer of the first dielectric material beneath the ground plane has a thickness less than a height of the semiconductor device die, and
• a second layer of a second dielectric material formed over and in contact with the ground plane.