Antenna in package device having substrate stack

A method forming an antenna-in-package (AiP) device, comprising:

• providing a ceramic substrate with a top side having an antenna disposed thereon attached to an organic substrate, wherein a dielectric constant of the ceramic substrate is higher as compared to a dielectric constant of the organic substrate, with one of the ceramic substrate and the organic substrate having metal balls thereon, wherein the ceramic substrate includes at least one interconnect for coupling a radio circuit to the antenna;
• flip chip die attaching an integrated circuit (IC) die having the radio circuit comprising at least a transmitter to another of the ceramic substrate and the organic substrate;
• thermal compression bonding the organic substrate to the ceramic substrate so that the metal balls attach the ceramic substrate to the organic substrate, and
• molding to form a mold compound that fills a gap between the ceramic substrate and the organic substrate.