Package integrated waveguide

A method of manufacturing a packaged semiconductor device, the method comprising:

• attaching a semiconductor die to a package substrate, a bond pad of the semiconductor die coupled to an antenna radiator formed at a surface of the package substrate;
• attaching a waveguide to the package substrate, an opening of the waveguide having conductive sidewalls substantially surrounding the antenna radiator;
• and
• depositing an epoxy material over at least a portion of the package substrate, the epoxy material in direct contact with the package substrate.

A packaged semiconductor device comprising:

• a package substrate having a first major surface and a second major surface;
• a semiconductor die having an active surface and a backside surface, the semiconductor die attached to the package substrate;
• a waveguide attached to the package substrate at the first major surface, an opening of the waveguide having conductive sidewalls;
• an antenna radiator at first major surface of the package substrate coupled to the semiconductor die by way of the package substrate, the antenna radiator exposed in the opening of the waveguide;
• and
• an epoxy material encapsulating at least a portion of the package substrate.