Piezoelectric transducer array fabrication

Abstract

Systems and techniques are provided for piezoelectric transducer array fabrication. A sheet of piezoelectric material may be diced into pieces of piezoelectric material. A sheet of elastic layer material may be spin coated with adhesive. The pieces of piezoelectric material may be placed onto the sheet of elastic layer material. Pressure may be applied to the pieces of piezoelectric material and the sheet of elastic layer material. The adhesive may be cured. Transduction elements may be cut from the pieces of piezoelectric material and the sheet of elastic layer material. Electronics may be mounted on a PCB mounting board. Adhesive may be applied onto the PCB mounting board. The transduction elements may be mounted on the PCB mounting board. A spacer may be mounted on the PCB mounting board. Adhesive may be applied onto the spacer and the transduction elements. Diaphragms may be mounted on the spacer.

Dependencies are inferred from the claim text.