Integrated photosensitive module, photosensitive assembly, camera module and preparation method therefor

A photosensitive module suitable for a camera module, comprising:

• a photosensitive element, wherein the photosensitive element has a photosensitive region and a non-photosensitive region;
• a light transmitting element, wherein the light transmitting element is provided on a photosensitive path of the photosensitive element;
• and
• an isolation adhesive layer, wherein the isolation adhesive layer is provided in the non-photosensitive region and supports the light transmitting element, wherein the isolation adhesive layer is formed by using photolithography technology.

A photosensitive assembly suitable for a camera module, comprising:

• a photosensitive module, wherein the photosensitive module includes a photosensitive element, an isolation adhesive layer and a light transmitting element, wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the isolation adhesive layer is provided on the non-photosensitive region, and supports the light transmitting element corresponding to the photosensitive region, wherein the isolation adhesive layer is formed using photolithography technology;
• a circuit layer, wherein the circuit layer is electrically connected to the photosensitive element;
• and
• a molding body, wherein the molding body encapsulates the photosensitive module and the circuit layer, wherein an exposed side of the light transmitting element is exposed to the outside for light to enter.

A method for manufacturing a photosensitive component, including:

• (a) forming a plurality of isolation adhesive layers at a preset position of a chip wafer by a photolithography process, wherein the chip wafer has a plurality of photosensitive elements arranged in an array, and each photosensitive element is provided with the isolation adhesive layer in its non-photosensitive region;
• (b) covering at least one light transmitting element on at least one of the isolation adhesive layers;
• and
• (c) cutting the chip wafer to form a plurality of photosensitive modules.