Semiconductor device packages and methods of manufacturing the same

A semiconductor device package, comprising:

• a redistribution layer;
• a first semiconductor device disposed on the redistribution layer and having a first lateral surface;
• a second semiconductor device stacked on the first semiconductor device and having a first lateral surface;
• a first insulation body disposed between the first semiconductor device and the second semiconductor device and having a first lateral surface;
• and
• a second insulation body encapsulating the first insulation body,
• wherein the first lateral surface of the first insulation body is substantially coplanar with the first lateral surface of the second semiconductor device.

A method of manufacturing a semiconductor device package, comprising:

• providing a wafer including a number of first semiconductor devices;
• forming a number of stacks of second semiconductor devices on the wafer;
• and
• encapsulating the number of stacks of second semiconductor devices and the wafer by a first insulation material.