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US 2020/0402957 A1Published application
Systems and methods for powering an integrated circuit having multiple interconnected die
AssigneeCerebras Systems Inc.
InventorJean-Philippe Fricker
Life of this patent
Estimating the term…
Abstract
The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.
Claims20
An assembly comprising:
- a printed circuit board (PCB) defining a first surface of the PCB;
- an integrated circuit having a first set of conductive pads arranged along a second surface of the integrated circuit opposing the first surface;
- a power converter arranged between first surface and the second surface, the power converter electrically connected to each of the first set of conductive pads;
- and
- a compliant connector extending between the first surface and the power converter.
2 more elements
Dependencies are inferred from the claim text.