Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYoshiharu TAKADA
Life of this patent
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Abstract
A semiconductor device includes a first lead portion and a second lead portion spaced from each other in a first direction. A semiconductor chip is mounted to the first lead portion. A first connector has a first portion contacting a second electrode on the chip and a second portion connected to the second lead portion. A second connector has third portion that contacts the second electrode, but at a position further away than the first portion, and a fourth portion connected to the second portion. At least a part of the second connector overlaps a part of the first connector between the first lead portion and the second lead portion.
Claims20
A semiconductor device, comprising:
- a first conductive lead portion;
- a second conductive lead portion spaced from the first conductive lead portion in a first direction;
- a semiconductor chip mounted on the first conductive lead portion and having a first electrode on a first surface of the semiconductor chip and a second electrode on a second surface, opposite to the first surface, of the semiconductor chip, the first surface facing the first conductive lead portion and the first electrode being electrically connected to the first conductive lead portion;
- a first connector including a first connection portion contacting the second electrode and a second connection portion connected to the second conductive lead portion;
- and
- a second connector including a third connection portion contacting the second electrode at a position further away from the second conductive lead portion in the first direction than a position at which the first connection portion contacts the second electrode and a fourth connection portion connected to the second connection portion, wherein
- at least a part of the second connector overlaps a part of the first connector, in a second direction orthogonal to the first surface, between the first conductive lead portion and the second conductive lead portion.
A packaged semiconductor device, comprising:
- a first lead frame portion;
- a semiconductor chip mounted on the first lead frame portion, the semiconductor chip having a first electrode facing the first lead frame portion and electrically connected to the first lead frame portion, a second electrode of the semiconductor chip facing away from the first lead frame portion;
- a second lead frame portion spaced from the first lead frame portion in a first direction;
- a first bent connector contacting the second electrode at first position and connecting the second electrode to the second lead frame portion;
- and
- a second bent connector contacting the second electrode at a second position further away from the second lead frame portion in the first direction than the first position and connecting the second electrode to the second lead frame portion, wherein
- the second bent connector includes a portion that overlaps a portion of the first bent connector.
Dependencies are inferred from the claim text.