US 2020/0402937 A1 · CONNECTIVITY BETWEEN INTEGRATED CIRCUIT DICE IN A MULTI-CHIP PACKAGE

Abstract

An integrated circuit package may be formed comprising an interposer with a center die and a plurality of identical integrated circuit dice positioned around the center die and attached to the interposer, wherein the center die is the switch/router for the plurality of identical integrated circuit dice. The interposer comprises a substrate, a central pattern of bond pads formed in or on the substrate for attaching the center die, and substantially identical satellite patterns formed in or on the substrate for attaching identical integrated circuit dice. The central pattern of bond pads has repeating sets of a specific geometric pattern and wherein the identical satellite patterns of bond pads are positioned to form the same geometric pattern as the specific geometric pattern of the central pattern of bond pads. Thus, substantially identical conductive routes may be formed between the center die and each of the identical integrated circuit dice.

Claims24

Dependent claims

An electronic interposer, comprising:

a substrate having a first surface;
a central pattern of bond pads on or in the first surface of the substrate;
a plurality of separate, substantially identical satellite patterns of bond pads on or in the first surface of the substrate around the central pattern of bond pads;
and
a plurality of separate, substantially identical conductive route patterns on or in the substrate connecting at least a portion of the bond pads of the central pattern and at least a portion of the bond pads of each satellite pattern of the plurality of separate, substantially identical satellite patterns.

2 more elements

An integrated circuit package, comprising:

an interposer, including:
a substrate having a first surface;
a central pattern of bond pads on or in the first surface of the substrate;
a plurality of separate, substantially identical satellite patterns of bond pads on or in the first surface of the substrate around the central pattern of bond pads;
and
a plurality of separate, identical conductive route patterns on or in the substrate connecting at least a portion of the bond pads of the central pattern and at least a portion of the bond pads of each satellite pattern of the plurality of separate, substantially identical satellite patterns;
a central die electrically attached to the central pattern of bond pads;
and
a plurality of substantially identical integrated circuit dice, wherein each integrated circuit die of the plurality of substantially identical integrated circuit dice is electrically connected to a corresponding satellite pattern of the plurality of separate, substantially identical satellite pattern.

6 more elements

An electronic system, comprising:

a board;
and
an integrated circuit package electrically attached to the board, wherein the integrated circuit package comprises:
an interposer, including a substrate having a first surface, a central pattern of bond pads on or in the first surface of the substrate, a plurality of separate, substantially identical satellite patterns of bond pads on or in the first surface of the substrate around the central pattern of bond pads, and a plurality of separate, identical conductive route patterns on or in the substrate connecting at least a portion of the bond pads of the central pattern and at least a portion of the bond pads of each satellite pattern of the plurality of separate, substantially identical satellite patterns;
a central die electrically attached to the central pattern of bond pads;
and
a plurality of substantially identical integrated circuit dice, wherein each integrated circuit die of the plurality of substantially identical integrated circuit dice is electrically connected to a corresponding satellite pattern of the plurality of separate, substantially identical satellite patterns.

4 more elements

Dependencies are inferred from the claim text.

Connectivity between integrated circuit dice in a multi-chip package

Life of this patent

Connectivity between integrated circuit dice in a multi-chip package

Life of this patent

Abstract

Claims24