Semiconductor package

A semiconductor package comprising:

• a first substrate having a first surface;
• a first bump pad on the first surface of the first substrate;
• a second substrate having a second surface located opposite the first surface of the first substrate;
• a second bump pad and a neighboring second bump pad on the second surface of the second substrate, the second bump pad having two recess structures that are each recessed from a side surface of the second bump pad toward a center thereof, the neighboring second bump pad neighboring the second bump pad and including two recess structures, and a first virtual line extending along the two recess structures of the second bump pad being perpendicular to a second virtual line extending along the two recess structures of the neighboring second bump pad;
• and
• a bump structure contacting the first bump pad and the second bump pad.

A semiconductor package comprising:

• a first substrate having a first surface and including a first through electrode;
• a first bump pad on the first surface of the first substrate, the first bump pad being connected to the first through electrode;
• a second substrate having a second surface located opposite to the first surface of the first substrate, the second substrate including a second through electrode and other second through electrodes;
• a second bump pad and neighboring second bump pads on the second surface of the second substrate, the second bump pad having a recess structure that is recessed from a side surface of the second bump pad toward a center thereof, the second bump pad being connected to the second through electrode, the neighboring second bump pads neighboring the second bump pad and including recess structures, the recess structures of the neighboring second bump pads being oriented in different directions, a corresponding one of the neighboring second bump pads being connected to at least two of the other second through electrodes;
• and
• a bump structure contacting the first bump pad and the second bump pad.