Semiconductor package and manufacturing method thereof

A manufacturing method of a semiconductor package, comprising:

• forming a patterned dielectric layer on conductive features to form a first redistribution structure, wherein the patterned dielectric layer comprises a plurality of openings and a recessed area surrounded by the plurality of openings, and the patterned dielectric layer overlies a space of the conductive features to form the recessed area;
• forming each of a plurality of conductive connectors on one of the plurality of openings of the patterned dielectric layer to be in contact with the conductive features;
• placing a semiconductor die over the recessed area of the patterned dielectric layer with a die attach material interposed therebetween;
• and
• encapsulating the plurality of conductive connectors, the semiconductor die, and the die attach material with an insulating encapsulant.

A manufacturing method of a semiconductor package, comprising:

• forming a first patterned dielectric layer on a dielectric material to cover conductive features;
• placing a semiconductor die over the first patterned dielectric layer with a die attach material interposed therebetween;
• pressing the semiconductor die toward the first patterned dielectric layer to extrude the die attach material beyond a bottom edge of the semiconductor die, wherein in a top view, a width of an extruded portion of the die attach material increases from a vertex of the bottom edge of the semiconductor die toward a midpoint of the bottom edge of the semiconductor die and decreases from the midpoint of the bottom edge of the semiconductor die to another vertex of the bottom edge of the semiconductor die;
• forming an insulating encapsulant on the first patterned dielectric layer to cover the semiconductor die and the die attach material;
• removing a portion of the dielectric material to form a second pattern dielectric layer having openings accessibly reveal at least a portion of the conductive features;
• and
• disposing a semiconductor device over the second pattern dielectric layer opposite to the semiconductor die.