Integrated Circuit Saw Bow Break Point

A method of providing a saw bow to a semiconductor device die on a wafer, the method comprising:

• forming integrated circuitry within one or more metal layers on a wafer, wherein
• the integrated circuitry is arranged in a grid pattern of a plurality of device die regions including a first semiconductor device die region and a second semiconductor device die region, and
• the first semiconductor device die region is separated from the second semiconductor device die region by a dicing lane;
• and
• forming a first conductor extending from a side of the first semiconductor device die region into the dicing lane and toward the second semiconductor device die region, wherein
• the first conductor is coupled to a metal layer of the one or more metal layers,
• the first conductor ends within a seal ring region of the second semiconductor device die region,
• the first conductor comprises a first region located nearer to the first semiconductor device die region and a second region located nearer to the second semiconductor device die region, and
• the first conductor comprises a lower tensile strength in the first region than the second region.

A semiconductor device die having integrated circuitry implemented in one or more metal layers, the semiconductor device die comprising:

• a first conductor exposed within a recess formed in a first sidewall of the semiconductor device die, wherein the first conductor has a first width;
• and
• a second conductor exposed at a surface of a second sidewall of the semiconductor device die, wherein
• the second sidewall is opposite the first sidewall,
• the second conductor has a second width, and
• the second width is larger than the first width.