Beol electrical fuse and method of forming the same

A structure comprising:

• an interconnect level including at least one electrically conductive structure embedded in an interconnect dielectric material layer;
• a dielectric material layer having a via opening located on the interconnect level, wherein the via opening physically exposes a surface of the at least one electrically conductive structure;
• an electrode structure present in at least the via opening, wherein a fuse element is located beneath the electrode structure that is present in the via opening, the fuse element having a void that is present along at least one sidewall of the electrode structure that is present in the via opening, and wherein the electrode structure is composed of a material having a higher electromigration (EM) resistance than the fuse element;
• and
• a metal-containing structure located directly on at least the electrode structure.

A method of forming a structure, the method comprising:

• forming an interconnect level including at least one electrically conductive structure embedded in an interconnect dielectric material layer;
• forming a dielectric material layer having a via opening on the interconnect level, wherein the via opening physically exposes a surface of the at least one electrically conductive structure;
• forming a fuse element-containing layer on the dielectric material layer and within the via opening by depositing a fuse element-containing seed layer and then subjecting the fuse element-containing seed layer to a reflow anneal;
• and
• forming an electrode material layer on the fuse element-containing layer, wherein the electrode material layer has a higher electromigration (EM) resistance than the fuse element-containing layer;
• removing at least a portion of the electrode material layer and a portion of the fuse element-containing layer that are present out the via opening, while maintaining the electrode material layer and the fuse element-containing material layer in the via opening;
• and
• forming a metal-containing structure on a remaining portion of the electrode material layer.