Method of manufacturing semiconductor devices and corresponding semiconductor device
AssigneeSTMicroelectronics S.r.l.
InventorAlberto ARRIGONI
Life of this patent
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Abstract
A leadframe for a semiconductor device includes an array of electrically-conductive leads. The electrically-conductive leads have mutually opposed lateral (vertical) surfaces. An electrically-insulating material is formed over the mutually lateral opposed surfaces to prevent short circuits between adjacent leads. The electrically-insulating material may further be provided at one or more of the opposed bottom and top surfaces of the electrically-conductive leads of the leadframe.
Claims7
A method for manufacturing a leadframe for a semiconductor device, wherein the leadframe comprises an array of electrically-conductive leads, wherein the method comprises:
- forming openings in a base layer having a opposed first and second surfaces to define electrically-conductive leads for said array of electrically-conductive leads which have mutually opposed lateral surfaces extending between the opposed first and second surfaces;
- forming an electrically-insulating material on said mutually opposed lateral surfaces and on the first surface but not on the second surface so that the second surface of each electrically-conductive lead is uncovered.
A semiconductor device, comprising:
- a leadframe comprising an array of electrically-conductive leads extending from a die pad, with electrically-conductive leads in said array of electrically-conductive leads having opposed first and second surfaces and mutually opposed lateral surfaces extending between the opposed first and second surface;
- an electrically-insulating material formed over said mutually opposed surfaces and on the first surface but not on the second surface so that the second surface of each electrically-conductive lead is uncovered;
- and
- at least one semiconductor chip or die attached on said die pad in said leadframe.
Dependencies are inferred from the claim text.