Semiconductor device package and method for manufacturing the same

A semiconductor device package, comprising:

• a first substrate including a first surface;
• a second substrate disposed over the first surface of the first substrate, wherein the second substrate includes a second surface facing the first surface of the first substrate;
• and
• a conductive structure disposed between and electrically connected to the first substrate and the second substrate, wherein the conductive structure includes a first section electrically connected the first substrate, a second section electrically connected the second substrate, and a step section separating the first section from the second section.

A semiconductor device package, comprising:

• a first substrate;
• a second substrate disposed over the first substrate;
• a conductive structure disposed between the first substrate and the second substrate, wherein the conductive structure comprises a first section adjacent to the first substrate, and a second section adjacent to the second substrate;
• a first solder covering the first section of the conductive structure;
• and
• a second solder covering the second section of the conductive structure,
• wherein the first solder is spaced apart from the second solder, and a melting point of the first solder is different from that of the second solder.