Three-dimensional laminated integrated circuit

A three-dimensional stacked integrated circuit, comprising:

• a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, and the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other, wherein
• the plurality of interposers are formed of copper, aluminum, or silicon substrates, the plurality of interposers has vertical and horizontal grooves through which the coolant passes formed thereon, the grooves extend to edges of the copper, aluminum, or silicon substrates on surrounding surfaces of the three-dimensional stacked integrated circuit and open outside of the plurality of interposers, the three-dimensional stacked integrated circuit is cooled from inside by the coolant entering and being released layer-by-layer in the plurality of interposers from the surrounding surface of the three-dimensional stacked integrated circuit by immersion, and the vertical and horizontal grooves are formed avoiding parts configuring through vias.

A three-dimensional stacked integrated circuit, comprising:

• a plurality of integrated circuits having BGA packages formed thereon, wherein a lower part of each of the integrated circuits is provided with BGA terminals, an upper surface is provided with pads having a geometrical shape for connecting the BGA terminals with another integrated circuit, the integrated circuits are stacked vertically, the three-dimensional stacked integrated circuit is cooled by immersion using gaps in the BGA terminals of each of the stacked integrated circuits,
• the integrated circuits are pressed down by a holding mechanism so as not to shift when stacked vertically, the holding mechanism includes guides so that the stacked integrated circuits do not shift, a coolant flows through gaps of a ball grid of the BGA terminals, and
• the three-dimensional stacked integrated circuit includes an electrode placed on at least one of a corner and a peripheral part of the three-dimensional stacked integrated circuit, metal rod-shaped electrodes that come in contact with the electrode and supplies a GND potential and a power supply potential, and a capacitor provided between the rod-shaped electrode for supplying the power supply potential and the rod-shaped electrode for supplying the GND potential.

A three-dimensional stacked integrated circuit, comprising:

• a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, and the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other, wherein
• the three-dimensional stacked integrated circuit includes, above and below the integrated circuits in a stacking direction in the three-dimensional stacked integrated circuit, a metal plate including an aluminum plate not only for contacting BGAs included in the integrated circuits, but also for preventing decomposition of the three-dimensional stacked integrated circuit by pressure of cavitation, and clips for holding the metal plate at four points or more, and comprises an insulator sandwiched between the metal plate and a PCB on which the three-dimensional stacked integrated circuit is installed.

A three-dimensional stacked integrated circuit, comprising:

• a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, and the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other, wherein
• the three-dimensional stacked integrated circuit is cooled by immersion, and on any one side surface of the three-dimensional stacked integrated circuit, an adapter for injecting the coolant is attached, and a pump for injecting the coolant by positive pressure for preventing cavitation is provided.

A three-dimensional stacked integrated circuit, comprising:

• a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, and the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other, wherein
• the three-dimensional stacked integrated circuit includes an acoustic sensor and a clock frequency controlling device that uses an output of the acoustic sensor to control a clock frequency of the three-dimensional stacked integrated circuit and prevent occurrence of cavitation.

A three-dimensional stacked integrated circuit, comprising:

• a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other, and to prevent decomposition of the three-dimensional stacked integrated circuit by cavitation, the three-dimensional stacked integrated circuit comprises a metal plate including an aluminum plate provided above and below the integrated circuits in a stacking direction in the three-dimensional stacked integrated circuit, four or more metal rods for alignment, and clips for holding the metal plate at four points or more, and comprises insulators sandwiched between the metal plate and a PCB on which the three-dimensional stacked integrated circuit is mounted.