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US 2020/0402887 A1Published application
Semiconductor baseplates
AssigneeSemiconductor Components Industries, LLC
InventorsAtapol PRAJUCKAMOL, Francis J. CARNEY, Chee Hiong CHEW, Yushuang YAO
Life of this patent
Estimating the term…
Abstract
A semiconductor baseplate is disclosed. Specific implementations of a baseplate may include a planar portion including a plurality of recesses therein, the planar portion may be made of a first material, and a plurality of pegs where each peg of the plurality of pegs may be configured to fit within each recess of the plurality of recesses, the plurality of pegs may be made of a second material, where the first material and the second material may be bonded together.
Claims20
A baseplate comprising:
- a planar portion comprising a plurality of recesses therein, the planar portion further comprising a first material;
- and
- a plurality of pegs wherein each peg of the plurality of pegs is configured to fit within each recess of the plurality of recesses, the plurality of pegs further comprising a second material;
- wherein the first material and the second material are bonded together.
1 more element
A baseplate comprising:
- a planar portion comprising a plurality of recesses therethrough, the planar portion further comprising a first material;
- and
- a plurality of pegs wherein each peg of the plurality of pegs is configured to fit within each recess of the plurality of recesses, the plurality of pegs further comprising a second material;
- wherein the first material and the second material are bonded together.
1 more element
A baseplate comprising:
- a planar portion comprising a plurality of recesses therein, the planar portion further comprising a first material;
- and
- a plurality of pegs wherein each peg of the plurality of pegs is configured to fit within each recess of the plurality of recesses, the plurality of pegs further comprising a second material.
Dependencies are inferred from the claim text.