Semiconductor device and method of manufacturing a semiconductor device
AssigneeAmkor Technology Korea, Inc.
InventorsKeun Soo Kim, Young Ik Kwon, Yu Jin Jeon, Mi Kyoung Choi
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Abstract
In one example, a semiconductor device, comprises a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
Claims20
A semiconductor device, comprising:
- a substrate having a top side and a conductor on the top side of the substrate;
- an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect;
- a lid covering a top side of the electronic device;
- and
- a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole.
A method to manufacture a semiconductor device, comprising:
- providing patternings on a backside of an electronic device;
- placing the electronic device on a top side of a substrate, wherein the electronic device contacts a conductor on the top side of the substrate;
- providing a lid over the electronic device;
- injecting a thermal material into a through-hole of the lid;
- and
- filling the through-hole to seal the thermal material between the lid and the top side of the electronic device.
A semiconductor structure, comprising:
- a substrate having a top side and a conductor on the top side of the substrate;
- an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, wherein the electronic device has patternings on a top side of the electronic device;
- an encapsulant on the top side of the substrate adjacent to the electronic device;
- a lid covering the top side of the electronic device;
- and
- a thermal material between the top side of the electronic device and the lid.
Dependencies are inferred from the claim text.