Semiconductor packages having heat spreader
AssigneeSamsung Electronics Co., Ltd.
InventorsYounglyong Kim, Aenee Jang
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a lower semiconductor chip disposed on a substrate, at least one upper semiconductor chip disposed on the lower semiconductor chip, a heat spreader bonded on the lower semiconductor chip and the at least one upper semiconductor chip, and an encapsulant surrounding side surfaces of the heat spreader. A lower surface of the heat spreader includes a first protrusion and a non-protruding portion, the first protrusion is in contact with an upper surface of the lower semiconductor chip, and the non-protruding portion is in contact with an upper surface of the at least one upper semiconductor chip.
Claims20
A semiconductor package comprising:
- a lower semiconductor chip on a substrate;
- at least one upper semiconductor chip on the lower semiconductor chip;
- a heat spreader bonded on the lower semiconductor chip and the at least one upper semiconductor chip, the heat spreader including a first protrusion and a non-protruding portion on a lower surface thereof, the first protrusion being in contact with an upper surface of the lower semiconductor chip and the non-protruding portion being in contact with an upper surface of the at least one upper semiconductor chip;
- and
- an encapsulant surrounding at least the substrate, the lower semiconductor chip, the at least one upper semiconductor chip, and side surfaces of the heat spreader.
A semiconductor package comprising:
- a first lower semiconductor chip and a second lower semiconductor chip in parallel on a substrate;
- at least one first upper semiconductor chip on the first lower semiconductor chip;
- at least one second upper semiconductor chip on the second lower semiconductor chip;
- a first heat spreader bonded on the first lower semiconductor chip and the at least one first upper semiconductor chip, the first heat spreader including a protrusion and a non-protruding portion on a lower surface thereof such that the protrusion is in contact with the first lower semiconductor chip and the non-protruding portion is in contact with the at least one first upper semiconductor chip;
- and
- a encapsulant surrounding at least the substrate, the first lower semiconductor chip, the second lower semiconductor chip, the at least one first upper semiconductor chip, the at least one second upper semiconductor chip, and side surfaces of the first heat spreader.
A semiconductor package comprising:
- a lower semiconductor chip on a substrate;
- at least one upper semiconductor chip on the lower semiconductor chip;
- a heat spreader bonded on the lower semiconductor chip and the at least one upper semiconductor chip, the heat spreader including a protrusion and a non-protruding portion on a lower surface thereof such that the non-protruding portion is in contact with an upper surface of the at least one upper semiconductor chip;
- heat transfer materials connecting the lower semiconductor chip and the at least one upper semiconductor chip to the heat spreader;
- and
- a encapsulant surrounding the substrate, the lower semiconductor chip, the at least one upper semiconductor chip, and side surfaces of the heat spreader such that an upper surface of the heat spreader is partially exposed.
Dependencies are inferred from the claim text.