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US 2020/0402882 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsSangwon KIM, Heejeong Kim, Unbyoung Kang, Jongho Lee
Life of this patent
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Abstract
A semiconductor package includes a substrate, a semiconductor stack disposed on the substrate, and a heat slug covering the semiconductor stack. The heat slug includes a flat plate and sidewalls, and the sidewalls include an outer lower portion, and an inner lower portion recessed upwardly from the outer lower portion to form a cavity. The semiconductor package further includes an adhesive interposed between the substrate and the heat slug, and disposed in the cavity.
Claims20
A semiconductor package, comprising:
- a substrate;
- a semiconductor stack disposed on the substrate;
- a heat slug covering the semiconductor stack,
- wherein the heat slug comprises a flat plate and sidewalls, and
- wherein the sidewalls comprise an outer lower portion, and an inner lower portion recessed upwardly from the outer lower portion to form a cavity;
- and
- an adhesive interposed between the substrate and the heat slug, and disposed in the cavity.
4 more elements
A semiconductor package, comprising:
- a substrate;
- a semiconductor stack disposed on the substrate;
- a stiffener surrounding a side surface of the semiconductor stack;
- an adhesive interposed between the substrate and the stiffener;
- and
- a cavity containing the adhesive.
3 more elements
A semiconductor package, comprising:
- a substrate comprising a trench disposed in the substrate,
- wherein the trench has a width in a first range of 900 μm to 1100 μm, and
- wherein the trench has a depth in a second range of 180 μm to 220 μm;
- a semiconductor stack disposed on the substrate;
- a heat slug covering the semiconductor stack,
- wherein the heat slug comprises a flat plate and sidewalls, and
- wherein the sidewalls comprise an outer lower portion, and an inner lower portion recessed upwardly from the outer lower portion to form a cavity;
- and
- an adhesive interposed between the substrate and the heat slug, and disposed in the cavity.
6 more elements
Dependencies are inferred from the claim text.