Die Package and Method of Manufacturing a Die Package

A die package, comprising:

• a laminated carrier comprising at least one recess;
• a first die comprising a frontside, a backside, a frontside metallization on the frontside and a backside metallization on the backside, the first die being arranged in the at least one recess with its frontside, facing a bottom of the at least one recess
• a second die comprising a frontside, a backside, a frontside metallization on the frontside and a backside metallization on the backside, the second die being arranged in the at least one recess with its backside facing the bottom of the at least one recess;
• and
• a first encapsulating material partially encapsulating the first die by covering at least the frontside metallization or the backside metallization of the first die,
• wherein the backside metallization of the first die has a roughened surface at is in direct physical contact with the first encapsulating material,
• wherein the frontside metallization of the second die has a roughened surface that is in direct physical contact with the first encapsulating material.

A die package, comprising:

• a laminated carrier comprising at least one recess;
• a first die arranged in the at least one recess and comprising a frontside, a backside, a frontside metallization on the frontside and a backside metallization on the backside;
• a first encapsulating material partially encapsulating the first die by covering at least the frontside metallization or the backside metallization;
• a second encapsulating material covering the metallization that is not partially encapsulated by the first encapsulating material;
• and
• an adhesion promoter material between the metallization covered by the second encapsulation material and the second encapsulation material, and in direct physical contact with the second encapsulation material and the metallization covered by the second encapsulation material,
• wherein the metallization covered by the first encapsulation material has a roughened surface that is in direct physical contact with the first encapsulating material.

A die package, comprising:

• a laminated carrier comprising at least one recess;
• a first die arranged in the at least one recess and comprising a frontside, a backside, a frontside metallization on the frontside and a backside metallization on the backside;
• a first encapsulating material partially encapsulating the first die by covering at least the frontside metallization or the backside metallization, the metallization covered by the first encapsulation material having a roughened surface that is in direct physical contact with the first encapsulating material;
• and
• a second encapsulating material covering the metallization that is not partially encapsulated by the first encapsulating material, the metallization covered by the second encapsulation material having a roughened surface that is in direct physical contact with the second encapsulating material.

A method of manufacturing a die package, the method comprising:

• placing a first die comprising a frontside, a backside, a frontside metallization on the frontside and a backside metallization on the backside into at least one recess of a laminated carrier onto a removable carrier;
• surface-treating the metallization facing away from the removable carrier by forming an adhesion promoter material onto the metallization facing away from the removable carrier and/or by roughening the surface of the metallization facing away from the removable carrier;
• partially encapsulating the first die such that a first encapsulating material covers at least the metallization facing away from the removable carrier;
• and
• removing the removable carrier to expose at least a portion of the metallization facing the removable carrier.

A method of manufacturing a die package, the method comprising:

• providing a wafer comprising a plurality of dies, each die comprising a frontside, a backside, a frontside metallization on the frontside and a backside metallization on the backside;
• roughening a surface of the frontside metallization of the dies or of the backside metallization of the dies;
• singulating the wafer into the plurality of dies;
• placing at least one of the dies into at least one recess of a laminated carrier onto a removable carrier with the roughened surface facing the removable carrier;
• surface-treating the metallization facing away from the removable carrier by forming an adhesion promoter material onto the metallization facing away from the removable carrier and/or by roughening the surface of the metallization facing away from the removable carrier;
• partially encapsulating the dies such that a first encapsulating material covers at least the metallization facing away from the removable carrier;
• and
• removing the removable carrier to expose at least a portion of the metallization facing the removable carrier.