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US 2020/0402880 A1Published application
Semiconductor module, vehicle, and method of manufacturing semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorsKohei YAMAUCHI, Tatsuhiko ASAI
Life of this patent
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Abstract
There is provided a semiconductor module including: a base for semiconductor cooling; a stacked substrate provided above the base; a semiconductor chip provided above the stacked substrate; a coating layer provided on an upper surface of the semiconductor chip; and a sealing resin for sealing the semiconductor chip, in which the base is in contact with the sealing resin.
Claims14
A semiconductor module comprising:
- a base for semiconductor cooling;
- a stacked substrate provided above the base;
- a semiconductor chip provided above the stacked substrate;
- a coating layer provided on an upper surface of the semiconductor chip;
- and
- a sealing resin for sealing the semiconductor chip, wherein
- the base is in contact with the sealing resin.
4 more elements
A method of manufacturing a semiconductor module, the method comprising:
- providing a base for semiconductor cooling;
- providing a stacked substrate above the base;
- providing a semiconductor chip above the stacked substrate;
- providing a coating layer on an upper surface of the semiconductor chip;
- and
- sealing the semiconductor chip with a sealing resin, wherein
- the base is in contact with the sealing resin.
4 more elements
Dependencies are inferred from the claim text.