Semiconductor package structure and method for manufacturing the same

A semiconductor package structure, comprising:

• a substrate;
• a first die on the substrate;
• a second die on the first die, the second die comprising a plurality of cell regions, each of the cell regions comprising a membrane portion, a receiving portion connected to the membrane portion, and a transmission portion connected to the membrane portion;
• and
• a sealing structure surrounding the plurality of cell regions.

A semiconductor package structure, comprising:

• a substrate;
• a first die on the substrate, wherein an active surface of the first die is facing away from the substrate;
• a second die on the active surface of the first die, the second die comprising a plurality of cell regions and electrically connected to the first die;
• and
• a sealing structure on the active surface of the first die, the sealing structure surrounding the plurality of cell regions thereby forming a cavity for the plurality of cell regions.