Grounding lids in integrated circuit devices
AssigneeNXP USA, Inc.
InventorsDwight Lee DANIELS, Stephen Ryan HOOPER, Michael B. VINCENT
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a substrate, an IC die mounted on the substrate, packaging encapsulant on the substrate, a cavity in the packaging encapsulant, a conductive lid attached to the packaging encapsulant over the IC die, an electrical ground path in the substrate, and a first conductive structure in the cavity. The first conductive structure includes a first end electrically coupled to the conductive lid and a second end electrically coupled to the electrical ground path.
Claims21
A semiconductor device comprising:
- a substrate;
- an IC die mounted on the substrate;
- packaging encapsulant on the substrate;
- a cavity in the packaging encapsulant;
- a conductive lid attached to the packaging encapsulant over the IC die;
- an electrical ground path in the substrate;
- a first conductive structure in the cavity, the first conductive structure including a first end electrically coupled to the conductive lid and a second end electrically coupled to the electrical ground path.
11-19. (canceled)
A packaged semiconductor device comprising:
- a leadframe;
- a cavity over the leadframe;
- a lid over the cavity;
- an integrated circuit (IC) die in the cavity attached to the leadframe;
- a wirebond having one end attached to a ground node in the cavity and another end embedded in adhesive attaching the lid to a top edge of a sidewall of the cavity, the lid being in electrical contact with the wirebond.
A semiconductor device comprising:
- a first integrated circuit (IC) die attached to a first leadframe;
- a first integrated circuit (IC) die attached to a second leadframe adjacent the first leadframe;
- encapsulant forming a first package on the first leadframe and a second package on the second leadframe, wherein the first and second packages include inner sidewalls around a respective cavity;
- a first electrical grounding structure having a first end of an electrically conductive material attached to a ground node in the cavity of the first package and a second end of the electrically conductive material attached to a ground node in the cavity of the second package, wherein the electrically conductive material extends over a top edge of one of the sidewalls of each of the respective cavities of the first and second packages;
- a first lid attached over the cavity of the first package and a second lid attached over the cavity of the second package, the first electrical grounding structure being electrically coupled to the first and second lids.
Dependencies are inferred from the claim text.