Package Structures and Methods of Forming the Same

A method comprising:

• bonding a first die to a first side of a first interposer;
• bonding a stack of memory dies to the first side of the first interposer, the stack of memory dies comprising a top die, the top die being the furthest die in the stack of memory dies from the first side of the first interposer, the top die having a thickness greater than a thickness of each of the other dies in the stack of memory dies;
• and
• bonding a package substrate to a second side of the first interposer, the second side being opposite the first side.

A structure comprising:

• a first die bonded to a first side of a first substrate using first electrical connectors;
• a dummy die attached to the first side of the first substrate in a scribe line region of the first substrate;
• a cover structure attached to a backside of the first die;
• an underfill between the first die and the first side of the first substrate, the underfill surrounding the first electrical connectors;
• and
• an encapsulant on the first substrate, the underfill, and the cover structure and on sidewalls of the first die and the dummy die.