Back to results
US 2020/0402873 A1Published application
Electronic device mounting board, electronic package, and electronic module
AssigneeKYOCERA Corporation
InventorKenichi KOHAMA
Life of this patent
Estimating the term…
Abstract
An electronic device is mountable on a substrate. The substrate includes a first layer and a second layer located on a lower surface of the first layer. The first layer includes a plurality of first through-cavities. The second layer includes at least one second through-cavity overlapping the plurality of first through-cavities in a plan view. The plurality of first through-cavities are continuous with the at least one second through-cavity.
Claims16
An electronic device mounting board, comprising:
- a substrate on which an electronic device is mountable, the substrate including a first layer and a second layer located on a lower surface of the first layer;
- a plurality of first through-cavities located through the first layer in a thickness direction of the first layer;
- and
- at least one second through-cavity located through the second layer in a thickness direction of the second layer, the at least one second through-cavity overlapping the plurality of first through-cavities in a plan view,
- wherein each of the plurality of first through-cavities is continuous with the at least one second through-cavity.
2 more elements
Dependencies are inferred from the claim text.