Method For Manufacturing Led Display

A method for manufacturing an LED display by joining an LED substrate onto a wiring board, the LED substrate including a light transmitting wafer and LEDs formed in a plurality of rows at predetermined intervals on a first surface of the wafer, each LED having LED electrodes, the wiring board including wiring board electrodes and a circuit layer having a circuit configured to drive the LEDs and laminated on a first surface of the wiring board, and then by irradiating the LED substrate with laser light from a second surface of the wafer and peeling off the LEDs from the LED substrate so as to mount the LEDs on the wiring board so that the LED electrodes are electrically conductively connected to the wiring board electrodes, the method comprising:

• aligning the LED substrate with the wiring board,
• wherein each LED having the LED electrodes and a bonding surface on an upper surface of the LED, the bonding surface being disposed in a predetermined region neighboring the LED electrodes,
• wherein the wiring board further includes:
• a circuit layer having a circuit configured to drive the LEDs and laminated on a first surface of the wiring board;
• elastic support members disposed at predetermined positions on the circuit layer;
• stop layers disposed at positions corresponding to positions of the bonding surfaces and configured to restrict compression of the elastic support members when the LED substrate and the wiring board are pressed together;
• and
• bonding layers having photocurable and thermosetting properties and disposed on the stop layers, and
• wherein, in the aligning step, the bonding surfaces of the LEDs are positioned on upper surfaces of the bonding layers in the wiring board in preparation for joining the LED substrate onto the wiring board;
• pressing and joining the LED substrate onto the wiring board;
• temporarily bonding the LEDs onto the wiring board by curing the bonding layers through ultraviolet light irradiation from a second surface of the wafer while continuing to press the LED substrate against the wiring board;
• peeling off the LEDs from the LED substrate after laser light irradiation from the second surface of the wafer;
• and
• permanently bonding the LEDs onto the wiring board by heating the bonding layers of the LEDs mounted on the wiring board so as to further cure the bonding layers.