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US 2020/0402864 A1Published application
X-ray system, semiconductor package, and tray having x-ray absorption filter
AssigneeSamsung Electronics Co., Ltd.
InventorsSANG-YOUNG KIM, KYUNG-SOO RHO, HO-JEONG MOON, HYUCK SHIN, SUN-NYEONG JUNG
Life of this patent
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Abstract
An X-ray source is disposed and a detector is disposed adjacent to the X-ray source. A test specimen holder is disposed between the X-ray source and the detector. A filter is disposed between the X-ray source and the test specimen holder. The filter has a plate-shaped semiconductor, a granular semiconductor, or a combination thereof.
Claims20
A method for manufacturing a semiconductor device, comprising:
- preparing a semiconductor package having a package substrate, a semiconductor chip disposed on the package substrate, and an encapsulant covering the semiconductor chip on the package substrate;
- placing the semiconductor package on a package holder;
- radiating X-rays from a X-ray source onto the semiconductor package through a semiconductor filter, the semiconductor filter including a plate-shaped semiconductor, a granular semiconductor, or a combination thereof;
- and
- detecting X-rays from the semiconductor package.
2 more elements
A method for manufacturing a semiconductor device, comprising:
- preparing a semiconductor package having a package substrate, and a semiconductor chip disposed on the package substrate;
- placing the semiconductor package on a package holder;
- radiating X-rays from a X-ray source onto the semiconductor package through a semiconductor filter, the semiconductor filter comprising a semiconductor material selected from a group consisting of Si, Ge, GaAs, InP, InGaAs, InGaAsP, and a combination thereof;
- and
- detecting X-rays from the semiconductor package.
2 more elements
A method for manufacturing a semiconductor device, comprising:
- preparing a semiconductor package having a package substrate, a semiconductor chip disposed on the package substrate, and an encapsulant covering the semiconductor chip on the package substrate;
- placing the semiconductor package on a package holder;
- radiating X-rays from a X-ray source onto the semiconductor package through a semiconductor filter, the semiconductor filter is configured to transmit a hard X-ray and substantially prevent transmission of a soft X-ray;
- and
- detecting X-rays from the semiconductor package.
2 more elements
Dependencies are inferred from the claim text.