Wiring circuit and method for producing same
AssigneeKaneka Corporation
InventorsMutsuaki Murakami, Yuki Kawashima
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AssigneeKaneka Corporation
InventorsMutsuaki Murakami, Yuki Kawashima
Estimating the term…
The present disclosure relates to a wiring circuit, and a method for producing the wiring circuit, that includes graphite wiring having a specified thickness, a high electrical conductivity, and a high carrier mobility. The wiring circuit may include graphite wiring comprised of graphite where the graphite wiring has a thickness of 3 nm or more and less than 300 nm. The graphite may have an electrical conductivity along a graphite film plane direction of 18000 S/cm or more, and the graphite may have a carrier mobility along the graphite film plane direction of 9500 cm2/Vsec or more. The method for producing a wiring circuit may include steps of: (1) bonding a graphite film with a substrate; (2) plasma etching the graphite film to form a graphite thin film; and (3) etching the graphite thin film to form a wiring circuit.
A wiring circuit comprising:
A method for producing a wiring circuit, the method comprising steps (1), (2), and (3) in this order:
Dependencies are inferred from the claim text.