Carrier for back end of line processing
AssigneeCorning Incorporated
InventorsHoon Kim, Jin Su Kim, Varun Singh
Life of this patent
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Abstract
A carrier assembly is configured to support a wafer, including during back end of line (BEOL) processing. The carrier assembly includes dual carriers. A first carrier includes a stepped structure so as to situate the wafer. A side of the wafer is bonded to the first carrier without adhesive. The first carrier is positioned atop the second carrier, so as to be mechanically supported by the second carrier. Each carrier is made by wet etching of laminated glass, without mechanical polishing.
Claims20
A carrier assembly, comprising:
- a first carrier comprising an opening configured to accommodate a wafer, the first carrier being divided into a first segment and a second segment opposed to the first segment;
- and
- a second carrier comprising
- a projection structured to support the wafer;
- and
- a base disposed beneath the projection, the base configured to extend in a lateral direction on either side of the projection so as to support the first and second segments of the first carrier on opposed sides of the projection.
A method of processing a wafer, comprising:
- supporting the wafer in a first carrier, the first carrier being supported in turn by a second carrier;
- thinning the wafer while the wafer is positioned in the first carrier;
- detaching the first carrier from the second carrier;
- inverting the first carrier;
- and
- disposing the first carrier above a dicing stage.
A method of manufacturing a carrier assembly, comprising:
- constructing a first carrier of the carrier assembly by
- attaching a first cladding layer of the first carrier to a first core layer;
- and
- attaching a second cladding layer of the first carrier to the first core layer, such that the first core layer is sandwiched between the first cladding layer and the second cladding layer of the first carrier;
- performing a first etching process on the first carrier to expose a portion of the first core layer;
- and
- performing a second etching process on the first carrier to form a through hole, wherein formation of the through hole divides the first carrier into a first segment and a second segment.
Dependencies are inferred from the claim text.