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US 2020/0402830 A1Published application
Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby
AssigneeAmkor Technology, Inc.
InventorsRoger St. Amand, Young Do Kweon
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Abstract
An electronic device structure and a method for making an electronic device. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device that comprises the utilization of a carrier assisted substrate, and an electronic device manufactured thereby.
Claims20
A method of manufacturing an electronic device, the method comprising:
- receiving a first structure comprising:
- a redistribution structure (RDS) comprising a top RDS side, a bottom RDS side, and a lateral RDS side, wherein the RDS comprises at least one dielectric material and at least one conductive material;
- a bottom solder resist (SR) material on the bottom RDS side and comprising a top SR side, a bottom SR side, and a lateral SR side, wherein the bottom SR material comprises a bottom SR aperture that exposes a respective portion of the bottom RDS side from the bottom SR material;
- and
- a carrier on the bottom SR side, wherein a portion of the carrier is positioned in the bottom SR aperture;
- mounting an electronic component to the top RDS side;
- encapsulating at least a portion of the electronic component and at least a portion of the top RDS side in an encapsulating material;
- and
- removing at least most of the carrier, said removing comprising:
- removing a first part of the carrier;
- and
- removing a second part of the carrier, the second part of the carrier comprising at least some of the portion of the carrier that is positioned in the bottom SR aperture;
- and
- forming a conductive interconnection structure on the bottom RDS side and electrically connected to the at least one conductive material of the RDS through the bottom SR aperture.
11 more elements
A method of manufacturing an electronic device, the method comprising:
- receiving a first structure comprising:
- a redistribution structure (RDS) comprising a top RDS side, a bottom RDS side, and a lateral RDS side, wherein the RDS comprises at least one dielectric material and at least one conductive material;
- a first solder resist (SR) material on the bottom RDS side and comprising a first top SR side, a first bottom SR side, and a first lateral SR side, wherein the first SR material comprises a first SR aperture that exposes a respective portion of the bottom RDS side from the first SR material;
- a second solder resist (SR) material on the top RDS side and comprising a second top SR side, a second bottom SR side, and a second lateral SR side, wherein the second SR material comprises a second SR aperture that exposes a respective portion of the top RDS side from the second SR material;
- and
- a carrier on the first bottom SR side, wherein a portion of the carrier is positioned in the first SR aperture;
- mounting an electronic component to the top RDS side;
- encapsulating at least a portion of the electronic component and at least a portion of the top RDS side in an encapsulating material;
- removing at least most of the carrier;
- and
- forming a conductive interconnection structure on the bottom RDS side and electrically connected to the at least one conductive material of the RDS through the first bottom SR aperture.
8 more elements
An electronic device comprising:
- a redistribution structure (RDS) comprising a top RDS side, a bottom RDS side, and a lateral RDS side, wherein the RDS comprises at least one dielectric material and at least one conductive material;
- a top solder resist (SR) material on the top RDS side and comprising a top SR aperture that exposes a respective portion of the top RDS side;
- and
- a bottom solder resist (SR) material on the bottom RDS side and comprising a top SR side, a bottom SR side, and a lateral SR side,
- wherein the bottom SR material comprises a bottom SR aperture that exposes a respective portion of the bottom RDS side from the bottom SR material, and
- wherein a thickness of the bottom SR material is at least two times as thick as a thickness of the top SR material.
3 more elements
Dependencies are inferred from the claim text.