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US 2020/0402816 A1Published application
Release Film as Isolation Film in Package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai
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Abstract
A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.
Claims20
A package comprising:
- an encapsulant comprising a first top surface;
- a through-via penetrating through the encapsulant, wherein the through-via comprises a second top surface higher than the first top surface;
- a device encapsulated in the encapsulant, wherein the device comprises a semiconductor substrate having a back surface;
- a plurality of redistribution lines underlying and electrically connecting to the through-via and the device;
- a package component over and bonded to the through-via;
- and
- an underfill between the encapsulant and the package component, wherein the underfill is in contact with the encapsulant.
4 more elements
A package comprising:
- a first package comprising:
- an encapsulant comprising a first top surface and a second top surface lower than the first top surface;
- and
- a device encapsulated in the encapsulant, wherein the device comprises a semiconductor substrate with a back surface, and the back surface is higher than the second top surface of the encapsulant;
- an underfill over and contacting the first top surface of the encapsulant;
- and
- a second package over and contacting the underfill, wherein the second package is electrically connecting to the first package.
4 more elements
A package comprising:
- a molding compound;
- a device die encapsulated in the molding compound, wherein the device die comprises a semiconductor substrate;
- and
- a filling material comprising:
- a first portion extending into the molding compound to contact a sidewall of the device die;
- and
- a second portion over and contacting a top surface of the semiconductor substrate.
4 more elements
Dependencies are inferred from the claim text.