Multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• a multilayer body including a plurality of laminated dielectric layers and a plurality of inner electrode layers laminated on the plurality of dielectric layers, the multilayer body including a first main surface and a second main surface opposite to each other in a lamination direction, a first end surface and a second end surface opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction, and a first side surface and a second side surface opposite to each other in a width direction orthogonal to or substantially orthogonal to the lamination direction and the length direction;
• a first outer electrode disposed on the first end surface;
• and
• a second outer electrode disposed on the second end surface;
• wherein
• the multilayer body includes:
• an inner layer portion in which the plurality of inner electrode layers face each other;
• a first outer layer portion located on the first main surface side, the first outer layer portion including the plurality of dielectric layers located between the first main surface and each of a first outermost surface of the inner layer portion on the first main surface side and an extension line of the first outermost surface;
• a second outer layer portion located on the second main surface side, the second outer layer portion including the plurality of dielectric layers located between the second main surface and each of a second outermost surface of the inner layer portion on the second main surface side and an extension line of the second outermost surface;
• a third outer layer portion located on the first side surface side, the third outer layer portion including the plurality of dielectric layers located between the first side surface and a third outermost surface of the inner layer portion on the first side surface side;
• and
• a fourth outer layer portion located on the second side surface side, the fourth outer layer portion including the plurality of dielectric layers located between the second side surface and a fourth outermost surface of the inner layer portion on the second side surface side;
• at the first outer layer portion, a grain size in a dielectric layer of the plurality of dielectric layers located on the inner layer portion side is smaller than a grain size in a dielectric layer of the plurality of dielectric layers located on the first main surface side, and a grain size in a dielectric layer of the plurality of dielectric layers located along each of respective ridgeline portion sides on which the first main surface of the multilayer body crosses the first end surface and the second end surface is smaller than the grain size in a dielectric layer of the plurality of dielectric layers located on the first main surface side;
• and
• at the second outer layer portion, a grain size in a dielectric layer of the plurality of dielectric layers located on the inner layer portion side is smaller than a grain size in a dielectric layer of the plurality of dielectric layers located on the second main surface side, and a grain size in a dielectric layer of the plurality of dielectric layers located along each of respective ridgeline portion sides on which the second main surface of the multilayer body crosses the first end surface and the second end surface is smaller than the grain size in a dielectric layer of the plurality of dielectric layers located on the second main surface side.