Electronic component surface-mountable on circuit board

A method of manufacturing an electronic component surface-mountable on a circuit board by cutting a wafer,

• wherein the electronic component includes:
• an insulating base member having a mounting surface and first and second end surfaces, the electronic component being surface-mountable on the circuit board such that the mounting surface faces the circuit board, the first and second end surfaces being opposed to each other and connected with each other via the mounting surface;
• an internal conductor provided in the base member;
• a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor;
• and
• a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor,
• wherein the first external electrode has a first protrusion formed thereon, and the second external electrode has a second protrusion formed thereon,
• wherein the first external electrode includes a first electrode portion and a second electrode portion, the first electrode portion being flush with the mounting surface of the base member, the second electrode portion being provided on the first end surface of the base member,
• wherein the second external electrode includes a third electrode portion and a fourth electrode portion, the third electrode portion being flush with the mounting surface of the base member, the fourth electrode portion being provided on the second end surface of the base member, and
• wherein the first protrusion is formed on the first electrode portion of the first external electrode, and the second protrusion is formed on the third electrode portion of the second external electrode.