Modular, frequency-flexible, superconducting quantum processor architecture

A method of making a modular superconducting quantum processor, comprising:

• providing a first superconducting chip, the first superconducting chip comprising a first plurality of qubits each having substantially a first resonance frequency and a second plurality of qubits each having substantially a second resonance frequency, the first resonance frequency being different from the second resonance frequency;
• providing a second superconducting chip, the second superconducting chip comprising a third plurality of qubits each having substantially the first resonance frequency and a fourth plurality of qubits each having substantially the second resonance frequency;
• providing an interposer chip comprising interposer coupler elements configured to couple the second plurality of qubits having substantially the second resonance frequency to the fourth plurality of qubits having substantially the second resonance frequency;
• mounting the first superconducting chip and the second superconducting chip on a substrate;
• and
• mounting the interposer chip on at least a portion of the first superconducting chip, on at least a portion of the second superconducting chip, and on at least a portion of the substrate such that the first plurality of qubits, the second plurality of qubits, the third plurality of qubits and the fourth plurality of qubits are accessible from a side opposite to a side facing the substrate.

A quantum computer comprising a modular superconducting quantum processor, wherein the modular superconducting quantum processor comprises:

• a first superconducting chip comprising a first plurality of qubits each having substantially a first resonance frequency and a second plurality of qubits each having substantially a second resonance frequency, the first resonance frequency being different from the second resonance frequency;
• a second superconducting chip comprising a third plurality of qubits each having substantially the first resonance frequency and a fourth plurality of qubits each having substantially the second resonance frequency;
• and
• an interposer chip connected to said first superconducting chip and to said second superconducting chip, wherein the interposer chip comprises interposer coupler elements configured to couple the second plurality of qubits having substantially the second resonance frequency to the fourth plurality of qubits having substantially the second resonance frequency.