Semiconductor storage device

A semiconductor storage device which is capable of being placed into a host device and has a first surface and a second surface which is placed in an opposite side of the first surface, the semiconductor storage device comprising:

• a nonvolatile memory;
• a controller configured to control the nonvolatile memory;
• and
• a plurality of terminals exposed in the first surface, including a plurality of signal terminals used for signal transferring, wherein
• the controller is configured to transmit first data indicative of an internal temperature of the semiconductor storage device, second data indicative of a temperature of the second surface in a case where heat in the semiconductor storage device dissipates to an outside of the semiconductor storage device through the first surface, and third data indicative of a temperature of the second surface in a case where the heat in the semiconductor storage device dissipates to the outside of the semiconductor storage device through the first surface and the heat further dissipates to the outside of the semiconductor storage device through the second surface, using at least one of the signal terminals.

A memory system comprising:

• a host device;
• and
• a semiconductor storage device which is capable of being placed into the host device and includes a first surface and a second surface which is placed in an opposite side of the first surface,
• the semiconductor storage device being connectable to the host device in accordance with a NVMe specification, and
• the semiconductor storage device comprising:
• a nonvolatile memory;
• a controller configured to control the nonvolatile memory;
• and
• a plurality of terminals exposed in the first surface, including a plurality of signal terminals used for signal transferring, wherein
• the controller is configured to transmit first data indicative of a temperature of the controller measured by a temperature sensor, second data indicative of a temperature difference between the temperature of the controller and a temperature of the first surface, and third data indicative of a temperature difference between the temperature of the controller and a temperature of the second surface to the host device, using at least one of the signal terminals, wherein the controller transmits, in response to a request of acquiring SMART/Health Information received from the host device, the SMART/Health Information to the host device, the SMART/Health Information including the first data, the second data, and the third data, the first data being set as a value of Composite Temperature in the SMART/Health Information,
• the host device is configured to read the first data set in the Composite Temperature of the SMART/Health Information sent from the semiconductor storage device and the second data and the third data set in the SMART/Health Information, and to calculate a temperature of the first surface by subtracting a product of a first distribution ratio and the second data from the first data, and a temperature of the second surface by subtracting a product of a second distribution ratio and the third data from the first data,
• the first distribution ratio being a ratio to distribute a power consumption of the semiconductor storage device to the first surface, and the second distribution ratio being a ratio to distribute the power consumption of the semiconductor storage device to the second surface.

A memory system comprising:

• a host device;
• and
• a semiconductor storage device which is capable of being placed into the host device and includes a first surface and a second surface which is placed in an opposite side of the first surface,
• the semiconductor storage device comprising:
• a nonvolatile memory;
• a controller configured to control the nonvolatile memory;
• and
• a plurality of terminals exposed in the first surface, including a plurality of signal terminals used for signal transferring, wherein
• the controller is configured to transmit first data indicative of an internal temperature of the semiconductor storage device, second data indicative of a temperature of the second surface in a case where heat in the semiconductor storage device dissipates to an outside of the semiconductor storage device through the first surface, and third data indicative of a temperature of the second surface in a case where the heat in the semiconductor storage device dissipates to the outside of the semiconductor storage device through the first surface and the heat further dissipates to the outside of the semiconductor storage device through the second surface, using at least one of the signal terminals,
• the third data is smaller than the second data, and the second data and the third data are greater than data representing an ambient temperature of the semiconductor storage device.