Interposer
AssigneeRockley Photonics Limited
InventorsVivek Raghunathan, Aaron John Zilkie
Life of this patent
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Abstract
A silicon interposer. The silicon interposer including: a silicon layer, including one or more optical waveguides each connectable to an optical fiber; an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber; and one or more electrical interconnects, connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.
Claims24
A silicon interposer, including:
- a silicon layer, including one or more optical waveguides each connectable to an optical fiber;
- an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber;
- and
- one or more electrical interconnects, connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.
A method of manufacturing a silicon interposer, including the steps of:
- providing a double silicon-on-insulator wafer, (DSOI wafer) in which one or more optical waveguides are fabricated;
- forming an interface at each of the one or more optical waveguides suitable for connection to an optical fiber;
- providing an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber;
- and
- providing one or more electrical interconnects connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.
Dependencies are inferred from the claim text.