Microfabricated ultrasonic transducers and related apparatus and methods
AssigneeButterfly Network, Inc.
InventorsJonathan M. Rothberg, Susan A. Alie, Keith G. Fife, Nevada J. Sanchez, Tyler S. Ralston
Life of this patent
Estimating the term…
Loading patent…
AssigneeButterfly Network, Inc.
InventorsJonathan M. Rothberg, Susan A. Alie, Keith G. Fife, Nevada J. Sanchez, Tyler S. Ralston
Estimating the term…
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
(canceled)
An ultrasound device, comprising:
A method of forming an ultrasound device, wherein:
Dependencies are inferred from the claim text.