Method for inspecting surface of wafer, device for inspecting surface of wafer, and manufacturing method of electronic component

A device for inspecting a surface of a wafer, the device comprising:

• a laser source irradiating a surface of the wafer with a laser beam having three or more distinct wavelengths;
• a detector detecting a reflected light from the wafer when the surface of the wafer is irradiated with the laser beam;
• and
• a controller determining whether a foreign matter exists and whether the foreign matter is a metal or a non-metal based on reflectances with respect to the laser beam having the three or more distinct wavelengths.

A manufacturing method of an electronic component, the manufacturing method comprising steps of:

• forming a metal layer on a surface of a wafer;
• forming a resist pattern on a surface of the metal layer;
• irradiating the surface of the wafer with a laser beam having three or more distinct wavelengths after the step of forming the resist pattern to determine whether a foreign matter exists on the surface of the wafer based on reflectances with respect to the laser beam having the three or more distinct wavelengths;
• when the foreign matter exists, determining whether the foreign matter is a metal or a non-metal;
• and
• when no foreign matter exists or when the foreign matter is a metal, forming a plated layer on the metal layer.