Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
AssigneeCo-Tech Development Corp.
InventorsYUN-HSING SUNG, SHIH-SHEN LEE, HUNG-WEI HSU, CHUN-YU KAO
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Abstract
An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.
Claims14
An advanced electrodeposited copper foil having an uneven micro-roughened surface, characterized in that the micro-roughened surface has a plurality of production direction stripes and a plurality of fine strips which are formed by copper crystals, as observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, and at least five of the fine strips each have a minimum included angle that is greater than 20 degrees relative to the production direction stripes.
A copper clad laminate, comprising:
- a substrate;
- and
- an advanced electrodeposited copper foil disposed on the substrate and having an uneven micro-roughened surface that is bonded to a surface of the substrate, wherein the micro-roughened surface has a plurality of production direction stripes and a plurality of fine strips which are formed by copper crystals, as observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, and at least five of the fine strips each have a minimum included angle that is greater than 20 degrees relative to the production direction stripes.
Dependencies are inferred from the claim text.