Nickel alloy plating

A method of depositing a nickel-boron coating comprising at least 75% wt nickel, wherein the method comprises contacting the substrate with a coating solution having a pH of at least 11 comprising:

• a source of nickel ions;
• a reducing agent comprising a source of boron ions;
• a complexing agent;
• and
• a stabilizer agent comprising a source of ions selected from bismuth ions, tin ions, tellurium ions, selenium ions, indium ions and gallium ions.

A method of depositing a nickel-boron coating on a substrate,

• wherein the nickel-boron coating comprises
• at least 85% wt of nickel,
• boron in the range 1.0% wt to 10% wt, and
• a material selected from bismuth, tin, tellurium, selenium, indium, gallium and combinations of two or more thereof, in the range 0.1-5% wt, and the method comprising contacting the substrate with a coating solution having a pH of at least 11, the coating solution comprising:
• a source of nickel ions;
• a reducing agent comprising a source comprising a borohydride ;
• a complexing agent comprising ethylene diamine;
• and
• a stabilizer agent comprising a source of ions selected from bismuth ions, tin ions, tellurium ions, selenium ions, indium ions and gallium ions;
• and
• wherein the coating solution is lead-free, thallium-free and phosphorus free.