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US 2020/0399493 A1Published application
Composition, conductor, method for manufacturing same, and structure
AssigneeHitachi Chemical Company, Ltd.
InventorsKohsuke URASHIMA, Yoshinori EJIRI, Takaaki NOHDOH, Motoki YONEKURA, Ryuji AKEBI
Life of this patent
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Abstract
Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.
Claims8
A composition comprising:
- copper particles;
- and
- organic solvents,
- wherein the organic solvents comprise a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.
1 more element
Dependencies are inferred from the claim text.