Template that improves solder-paste stencilling and production method thereof
AssigneeInterlatin S De Rl De Cv
InventorsJimmy Villalvazo, Nestor Librado Castro Leyva
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AssigneeInterlatin S De Rl De Cv
InventorsJimmy Villalvazo, Nestor Librado Castro Leyva
Estimating the term…
The invention relates to a template or stencil with perforations, which improves solder-paste stencilling on an object and comprises: a first area treated with precision powder on a bottom laminar face of the template, said treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, said second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, said third area encircling the perforations of the template. The invention also relates to a method for producing a template that improves solder-paste stencilling on an object, and to a method for the improved application of solder-paste on an object, such as a printed circuit board.
A template which improves the solder-paste stencilling in an object, which has an top laminar face (2), a bottom laminar face (3), and perforations (4);
The template of the preceding claim, wherein the precision powder is aluminium oxide.
The template of the preceding claim, wherein the aluminium oxide has particles of about 10 microns.
A method for manufacturing a template which improves the solder-paste stencilling;
The method of the preceding claim, wherein the precision powder is aluminium oxide.
The method of the preceding indication, where the aluminium oxide has particles of at least 10 microns.
The method of the preceding claim, wherein the area of the perforations (4′) of the template-mask (7), is greater by 25.4μ2, compared to the perforations (4) of the template (1).
The method of the preceding claim, wherein the object is a printed circuit board.
Dependencies are inferred from the claim text.