Dual in-line package led device
OwnerXiaojun Xuinventor
Life of this patent
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Abstract
A dual in-line package (DIP) light emitting diode (LED) device includes a molded member, a positive lead passing through and fixed to the molded member, the positive lead comprising an upper end and lower end, a negative lead passing through and fixed to the molded member, the negative lead comprising an upper end and lower end, and at least one LED body connected to the top ends of the positive lead and the negative lead. The lower ends of the positive lead and the negative lead are flush with each other. The top end of the positive lead is higher than the top end of the negative lead. The positive lead and the negative lead are both bent at the top ends thereof.
Claims6
A dual in-line package (DIP) light emitting diode (LED) device comprising:
- a molded member;
- a positive lead passing through and fixed to the molded member, the positive lead comprising an upper end and lower end;
- a negative lead passing through and fixed to the molded member, the negative lead comprising an upper end and lower end;
- and
- at least one LED body connected to the top ends of the positive lead and the negative lead;
- wherein the lower ends of the positive lead and the negative lead are flush with each other, the top end of the positive lead is higher than the top end of the negative lead, the positive lead and the negative lead are both bent at the top ends thereof.
Dependencies are inferred from the claim text.