Semiconductor device having buried gate structure and method for fabricating the same
AssigneeSK hynix Inc.
InventorDong-Soo KIM
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Abstract
Disclosed is a semiconductor device for improving a gate induced drain leakage and a method for fabricating the same, and the method for fabricating semiconductor device may include forming a trench in a substrate; forming a gate dielectric layer over the trench, embedding a first dipole inducing portion in the gate dielectric layer on a lower side of the trench, filling a lower gate over the first dipole inducing portion, embedding a second dipole inducing portion in the gate dielectric layer on an upper side of the trench and forming an upper gate over the lower gate.
Claims19
A method for fabricating a semiconductor device comprising:
- forming a trench in a substrate;
- forming a gate dielectric layer over the trench;
- embedding a first dipole inducing portion in the gate dielectric layer on a lower side of the trench;
- filling a lower gate over the first dipole inducing portion;
- embedding a second dipole inducing portion in the gate dielectric layer on an upper side of the trench;
- and
- forming an upper gate over the lower gate.
Dependencies are inferred from the claim text.