Fowbcsp cmos chip module with a packaging structure

A FOWBCSP CMOS chip module with a packaging structure, comprising:

• a CMOS chip having a plurality of joints and a light sensing area on an upper side thereof;
• two stop bars being positioned on the upper side of the CMOS chip and at two sides of the light sensing area;
• a substrate installed on the upper side of the CMOS chip;
• the substrate having a penetrating through holes;
• the light sensing area of the CMOS chip and the two stop bars being located within the through hole so that light radiates the light sensing area through the through hole;
• and an upper side of the substrate being formed with a plurality of joints and a lower side of the substrate being formed with a plurality of joints;
• the joints on the lower side of the substrate being connected to the joints on the upper side of the substrate;
• and
• a glass being installed between the two stop bars and being formed with a gap between the glass and the CMOS chip;
• therefore, external light can incident into the glass to radiate on the CMOS chip.

AFOWBCSP CMOS chip module with a packaging structure comprising:

• A CMOS chip having a plurality of joints and a light sensing area on an upper side thereof.
• two stop bars being positioned on the upper side of the CMOS chip and at two sides of the light sensing area;
• a substrate installed on the upper side of the CMOS chip;
• the substrate having a penetrating through hole;
• the light sensing area of the CMOS chip and the two stop bars being located within the through hole so that light can radiate the light sensing area through the through hole;
• and a lower side of the substrate being formed with a plurality of joints;
• the joints on the lower side of the substrate being connected to the joints the upper side of the substrate;
• at least one side of the substrate and the joints on the at least one side of the substrate being extended out of the CMOS chip;
• and
• a glass installed at upper sides of two stop bars and a gap being formed between the glass and the CMOS chip;
• as a result, external light can directly radiate the CMOS chip through the glass.