Stack packages including a supporting substrate

A stack package comprising:

• a package substrate;
• a supporting substrate mounted on the package substrate and supported by first connection bumps and second connection bumps disposed between the supporting substrate and the package substrate;
• a first semiconductor die disposed on a first surface of the supporting substrate such that a first surface of the first semiconductor die faces the package substrate;
• first redistributed line (RDL) patterns disposed on the first surface of the supporting substrate to electrically connect the first connection bumps to the first semiconductor die;
• second RDL patterns disposed on the first surface of the supporting substrate to electrically connect the second connection bumps to the first semiconductor die;
• second semiconductor dies stacked on a second surface of the supporting substrate opposite to the first semiconductor die;
• third semiconductor dies stacked on the second semiconductor dies;
• first bonding wires electrically connected to the second semiconductor dies;
• and
• second bonding wires electrically connected to the third semiconductor dies,
• wherein the package substrate comprises:
• first wire bond fingers electrically connected to the first bonding wires;
• second wire bond fingers electrically connected to the second bonding wires;
• first bump bond fingers to which the first connection bumps are electrically connected;
• and
• second bump bond fingers to which the second connection bumps are electrically connected.