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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hao Hsu, Yung-Chi Lin, Wen-Chih Chiou
Estimating the term…
Provided are integrated circuit packages and methods of forming the same. An integrated circuit package includes at least one first die, a plurality of bumps, a second die and a dielectric layer. The bumps are electrically connected to the at least one first die at a first side of the at least one first die. The second die is electrically connected to the at least one first die at a second side of the at least one first die. The second side is opposite to the first side of the at least one first die. The dielectric layer is disposed between the at least one first die and the second die and covers a sidewall of the at least one first die.
An integrated circuit package, comprising:
The integrated circuit package of claim 6, wherein the dielectric layer is further disposed between two adjacent first dies.
An integrated circuit package, comprising:
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An integrated circuit package, comprising:
Dependencies are inferred from the claim text.