Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

A package assembly, comprising:

• a frame comprising silicon and having a first surface opposite a second surface, the frame further comprising:
• an oxide layer disposed over the first surface and the second surface;
• at least one cavity comprising one or more cavity walls extending from the first surface to the second surface, the at least one cavity further comprising a plurality of semiconductor dies disposed therein;
• a via comprising a via wall extending from the first surface to the second surface;
• and
• an insulating layer formed on the oxide layer, the insulating layer comprising an epoxy resin material having particles disposed therein;
• and
• a metal interconnection disposed within the via, wherein the insulating layer is disposed between the via surface and the electrical interconnection.

A package assembly, comprising:

• a frame comprising silicon and having a first surface opposite a second surface, the frame further comprising:
• an oxide layer disposed over the first surface and the second surface;
• at least one cavity comprising one or more cavity walls extending from the first surface to the second surface, the at least one cavity further comprising a plurality of semiconductor dies disposed therein, the plurality of semiconductor dies disposed in a stacked arrangement within the at least one cavity;
• a via comprising a via wall extending from the first surface to the second surface;
• and
• a first insulating layer formed on the oxide layer, the first insulating layer comprising an epoxy resin material having particles disposed therein;
• a first metal interconnection disposed within the via, wherein the first insulating layer is disposed between the via surface and the electrical interconnection;
• and
• a redistribution layer formed over the first insulating layer, the redistribution layer comprising a second insulating layer and a second metal interconnection disposed through the second insulating layer.